cystech electronics corp. spec. no. : c728q8 issued date : 2009.07.01 revised date : page no. : 1/8 MTB13N03Q8 cystek product specification n-channel logic level enhancement mode power mosfet MTB13N03Q8 bv dss 30v i d 11a r dson(max) 12.5m description the MTB13N03Q8 is a n-channel enhancement-mode mosfet, providing the designer with the best combination of fast switching, ruggedized device de sign, low on-resistance and cost effectiveness. the sop-8 package is universally preferred for all commercial-industrial surface mount applications and suited for low voltage applicati ons such as dc/dc converters. features ? single drive requirement ? low on-resistance ? fast switching characteristic ? dynamic dv/dt rating ? repetitive avalanche rated ? pb-free and halogen-free package symbol outline MTB13N03Q8 sop-8 pin 1 g gate d drain s source
cystech electronics corp. spec. no. : c728q8 issued date : 2009.07.01 revised date : page no. : 2/8 MTB13N03Q8 cystek product specification absolute maximum ratings (ta=25 c) parameter symbol limits unit drain-source voltage v ds 30 gate-source voltage v gs 20 v continuous drain current @ t c =25 c 11 continuous drain current @ t c =100c i d 9 pulsed drain current i dm 44 *1 avalanche current i as 11 a avalanche energy @ l=0.1mh, i d =11a, r g =25 e as 6 repetitive avalanche energy @ l=0.05mh e ar 3 *2 mj t a =25 3 *3 total power dissipation t a =100 p d 1.5 w operating junction and storage temp erature range tj, tstg -55~+175 c thermal data parameter symbol value unit thermal resistance, junction-to-case, max r th,j-c 25 c/w thermal resistance, junction-to-ambient, max r th,j-a 50 *3 c/w note : 1. pulse width limited by maximum junction temperature 2. duty cycle 1% 3. surface mounted on 1 in2 copper pad of fr-4 board, 125 c/w when mounted on minimum copper pad characteristics (t c =25 c, unless otherwise specified) symbol min. typ. max. unit test conditions static bv dss 30 - - v v gs =0, i d =250 a v gs(th) 1 1.5 3 v v ds = v gs , i d =250 a g fs *1 - 36 - s v ds =5v, i d =11a i gss - - 100 na v gs = 20 - - 1 v ds =24v, v gs =0 i dss - - 25 a v ds =20v, v gs =0, t j =125 c i d(on) *1 11 - - a v ds =10v, v gs =10v - 11 12.5 m v gs =10v, i d =11a r ds(on) *1 - 14 20 m v gs =4.5v, i d =9a dynamic ciss - 1930 - coss - 255 - crss - 150 - pf v gs =0v, v ds =15v, f=1mhz
cystech electronics corp. spec. no. : c728q8 issued date : 2009.07.01 revised date : page no. : 3/8 MTB13N03Q8 cystek product specification characteristics (t c =25 c, unless otherwise specified) symbol min. typ. max. unit test conditions qg (v gs =10v) *1, 2 - 22 - qg (v gs =4.5v) *1, 2 - 13 - qgs *1, 2 - 4.5 - qgd *1, 2 - 7.2 - nc v ds =15v, v gs =10v, i d =11a t d(on) *1, 2 - 10 - tr *1, 2 - 8 - t d(off) *1, 2 - 28 - t f *1, 2 - 5 - ns v ds =15v, i d =1a, v gs =10v, r gs =2.7 rg - 2 - v gs =15mv, v ds =0v, f=1mhz source-drain diode i s *1 - - 2.5 i sm *3 - - 10 a v sd *1 - - 1.2 v i f =i s , v gs =0v trr - 20 - ns qrr - 10 - nc i f =i s , di f /dt=100a/ s note : *1.pulse test : pulse width 300 s, duty cycle 2% *2.independent of operating temperature *3.pulse width limited by maximum junction temperature. ordering information device package shipping marking MTB13N03Q8 sop-8 (pb-free & halogen-free package) 2500 pcs / tape & reel b13n03
cystech electronics corp. spec. no. : c728q8 issued date : 2009.07.01 revised date : page no. : 4/8 MTB13N03Q8 cystek product specification characteristic curves
cystech electronics corp. spec. no. : c728q8 issued date : 2009.07.01 revised date : page no. : 5/8 MTB13N03Q8 cystek product specification characteristic curves(cont.)
cystech electronics corp. spec. no. : c728q8 issued date : 2009.07.01 revised date : page no. : 6/8 MTB13N03Q8 cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c728q8 issued date : 2009.07.01 revised date : page no. : 7/8 MTB13N03Q8 cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of t he package, measured on the package body surface.
cystech electronics corp. spec. no. : c728q8 issued date : 2009.07.01 revised date : page no. : 8/8 MTB13N03Q8 cystek product specification sop-8 dimension *: typical inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.1850 0.2007 4.70 5.10 i 0.0031 0.0110 0.08 0.28 b 0.1457 0.1614 3.70 4.10 j 0.0157 0.0323 0.40 0.83 c 0.2283 0.2441 5.80 6.20 k 0.0074 0.0102 0.19 0.26 d 0.0500* 1.27* l 0.0145 0.0204 0.37 0.52 e 0.0130 0.0201 0.33 0.51 m 0.0118 0.0197 0.30 0.50 f 0.1472 0.1527 3.74 3.88 n 0.0031 0.0051 0.08 0.13 g 0.0472 0.0638 1.20 1.62 o 0.0000 0.0059 0.00 0.15 h 0.1889 0.2007 4.80 5.10 notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material: ? lead: pure tin plated ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0 important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance . marking: 8-lead sop-8 plastic package cystek packa g e code: q8 top view a b front view f c d e g i h part a j k o m l n right side view part a device name date code
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